Beth Keser: search on Z-Library

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1

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Interconnection Technology Innovations in 2.5D Integrated Electronic Systems

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 485 KB

english, 2019

2

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Embedded Multi-die Interconnect Bridge (EMIB)

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 543 KB

english, 2019

3

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || NEPES’ Fan-Out Packaging Technology from Single die, SiP to Panel-Level Packaging

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 900 KB

english, 2019

4

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Embedded Die in Substrate (Panel-Level) Packaging Technology

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 883 KB

english, 2019

5

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Encapsulated Wafer-Level Package Technology (eWLCSP)

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 542 KB

english, 2019

6

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || SWIFT® Semiconductor Packaging Technology

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 2.48 MB

english, 2019

7

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Embedded Silicon Fan-Out (eSiFO®) Technology for Wafer-Level System Integration

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 1.01 MB

english, 2019

8

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Ultrathin 3D FO-WLP eWLB-PoP (Embedded Wafer-Level Ball Grid Array-Package-on-Package) Technology

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 680 KB

english, 2019

9

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || FO-WLP Market and Technology Trends

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 775 KB

english, 2019

10

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Temporary Carrier Technologies for eWLB and RDL-First Fan-Out Wafer-Level Packages

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 386 KB

english, 2019

11

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || The Role of Liquid Molding Compounds in the Success of Fan-Out Wafer-Level Packaging Technology

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 698 KB

english, 2019

12

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Equipment and Process for eWLB

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 1.81 MB

english, 2019

13

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || M-Series™ Fan-Out with Adaptive Patterning™

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 1.60 MB

english, 2019

14

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan-Out Wafer-Level Packaging (FO-WLP)

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 3.50 MB

english, 2019

15

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Excimer Laser Ablation for the Patterning of Ultra-fine Routings

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 430 KB

english, 2019

16

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 1.10 MB

english, 2019

17

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Embedding of Active and Passive Devices by Using an Embedded Interposer

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 1.05 MB

english, 2019

18

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Front Matter

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 132 KB

english, 2019

19

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Index

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 126 KB

english, 2019

20

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Enabling Low Temperature Cure Dielectrics for Advanced Wafer-Level Packaging

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 1.90 MB

english, 2019

21

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Tools for Fan-Out Wafer-Level Package Processing

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 1.26 MB

english, 2019

22

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Embedding of Power Electronic Components

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 596 KB

english, 2019

23

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Blade

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 419 KB

english, 2019

24

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || The Role of Pick and Place in Fan-Out Wafer-Level Packaging

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 782 KB

english, 2019

25

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Process and Equipment for eWLB

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 2.57 MB

english, 2019

26

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - A Study of the Board Level Reliability of Large 16FF Wafer Level Package for RF Transceivers

Wolter, Andreas, Baumeister, Horst, Yeni, Ceren, Waidhas, Bemd, Proschwitz, Jan, Wagner, Thomas, Keser, Beth

Year:

2020

File:

PDF, 673 KB

2020

27

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || History of Embedded and Fan-Out Packaging Technology

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 2.98 MB

english, 2019

28

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Board level reliability and surface mount assembly of 0.35mm and 0.3mm pitch wafer level packages

Keser, Beth, Alvarado, Rey, Choi, Alan, Schwarz, Mark, Bezuk, Steve

Year:

2014

Language:

english

File:

PDF, 1.17 MB

english, 2014

29

Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies ||

Keser, Beth, Kroehnert, Steffen

Year:

2019

Language:

english

File:

PDF, 29.25 MB

english, 2019

30

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Study of the Board Level Reliability Performance of a Large 0.3 mm Pitch Wafer Level Package

Waidhas, Bernd, Proschwitz, Jan, Pietryga, Christoph, Wagner, Thomas, Keser, Beth

Year:

2019

Language:

english

File:

PDF, 633 KB

english, 2019

31

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Multi DOE Study on 28nm (RF) WLP Package to Investigate BLR Performance of Large WLP Die with 0.35mm Ball Pitch Array

Alvarado, Rey, Keser, Beth, Cui, Tong, Syed, Ahmer, Xu, Steven, Roggeman, Brian

Year:

2017

Language:

english

File:

PDF, 703 KB

english, 2017

32

WL-CSP reliability with various solder alloys and die thicknesses

Beth Keser, Li Wetz, Jerry White

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 747 KB

english, 2004

33

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions

Cui, Tong, Syed, Ahmer, Keser, Beth, Alvarado, Rey, Xu, Steven, Schwarz, Mark

Year:

2014

Language:

english

File:

PDF, 1023 KB

english, 2014

34

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - A study of wafer level package board level reliability

Xu, Steven, Keser, Beth, Hau-Riege, Christine, Bezuk, Steve, Yau, You-Wen

Year:

2013

Language:

english

File:

PDF, 1.51 MB

english, 2013

35

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Electromigration studies of lead-free solder balls used for wafer-level packaging

Hau-Riege, Christine, Zang, Ricky, Yau, You-Wen, Yadav, Praveen, Keser, Beth, Lin, Jong-Kai

Year:

2011

Language:

english

File:

PDF, 1.18 MB

english, 2011

36

Embedded Die Technology Breakthrough: The Redistributed Chip Package

KESER, Beth, AMRINE, Craig, LEAL, George, LYTLE, William, MITCHELL, Doug, WENZEL, Robert

Journal:

Journal of Japan Institute of Electronics Packaging

Year:

2008

Language:

english

File:

PDF, 3.72 MB

english, 2008

37

Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies ||

Keser, Beth, Kroehnert, Steffen

Year:

2019

File:

PDF, 29.25 MB

2019

38

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - The impact of different under bump metallurgies and redistribution layers on the electromigration of solder balls for wafer-level packaging

Hau-Riege, Christine, Keser, Beth, Alvarado, Rey, Syed, Ahmer, Yau, YouWen, Bezuk, Steve, Caffey, Kevin

Year:

2014

Language:

english

File:

PDF, 2.91 MB

english, 2014

39

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - The Redistributed Chip Package: A Breakthrough for Advanced Packaging

Keser, Beth, Amrine, Craig, Duong, Trung, Fay, Owen, Hayes, Scott, Leal, George, Lytle, William, Mitchell, Doug, Wenzel, Robert

Year:

2007

Language:

english

File:

PDF, 2.60 MB

english, 2007

40

[IEEE 2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - Boston, MA, USA (2007.09.30-2007.10.2)] 2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - Advanced Packaging: The Redistributed Chip Package

Keser, Beth, Amrine, Craig, Duong, Trung, Hayes, Scott, Leal, George, Lytle, William, Mitchell, Doug, Wenzel, Robert

Year:

2007

Language:

english

File:

PDF, 1.65 MB

english, 2007

41

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Exploration of the design space of wafer level packaging through numerical simulation

Bao, Zhongping, Burrell, James, Keser, Beth, Yadav, Praveen, Kalchuri, Shantanu, Zang, Ricky

Year:

2011

Language:

english

File:

PDF, 908 KB

english, 2011

42

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Study of new alloy composition for solder balls - Identifying material properties as key leading indicators toward improved board level performance

Alvarado, Rey, Keser, Beth, Zhou, Eric, Schwarz, Mark, Bezuk, Steve, Wang, Henry, Heng, Kok-Lin

Year:

2015

Language:

english

File:

PDF, 2.91 MB

english, 2015

43

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - 0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size

Keser, Beth, Alvarado, Rey, Schwarz, Mark, Bezuk, Steve

Year:

2015

Language:

english

File:

PDF, 1.34 MB

english, 2015

44

[IEEE 2007 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference - Salvador, Brazil (2007.10.29-2007.11.1)] 2007 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference - Emerging technologies for wireless handsets

Pacheco, Sergio, Keser, Beth, Liu, Lianjun, Abrokwah, Jon

Year:

2007

Language:

english

File:

PDF, 581 KB

english, 2007

45

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Reliability evaluation on low k wafer level packages

Yadav, Praveen, Kalchuri, Shantanu, Keser, Beth, Zang, Ricky, Schwarz, Mark, Stone, Bill

Year:

2011

Language:

english

File:

PDF, 1.17 MB

english, 2011

46

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Foreword

Keser, Beth, Braunisch, Henning

Year:

2015

Language:

english

File:

PDF, 146 KB

english, 2015

47

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Electromigration of solder balls for wafer-level packaging with different under bump metallurgy and redistribution layer thickness

Hau-Riege, Christine, Keser, Beth, Yau, You-Wen, Bezuk, Steve

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

48

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Implementation of a mobile phone module with redistributed chip packaging

Ramanathan, Lakshmi N., Keser, Beth, Amrine, Craig, Duong, Trung, Hayes, Scott, Leal, George, Mangrum, Marc, Mitchell, Douglas, Wenzel, Robert

Year:

2008

Language:

english

File:

PDF, 801 KB

english, 2008

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